Azbil Corporation No. SS2-MTG300-0100 - 15 - Model MTG18A - Wafer type size 25 mm (1 inch) to 100 mm (4 inches) Note 1 . When grounding ring material is SUS316, gasket dimension is not included to the face-to-face dimension. . When grounding ring material is other than SUS316, a 3 mm of Teflon gasket dimension is included to the face-to-face dimension. Table 4 Flange rating 25 mm (1 inch) 40 mm (1. inch) 50 mm (2 inches) 65 mm (2. inches) 80 mm (3 inches) 100 mm (4 inches) Face-to-face dimension code A A S A S A A S A S Dimension size L 94 (3.7) 80 (3.15) 98 (3.86) 86 (3.39) 104 (4.09) 96 (3.78) 106 (4.17) 130 (5.12) 120 (4.72) 150 (5.91) H 238 (9.37) 254.5 (10.02) 272 (10.71) 289 (11.38) 302 (11.89) 327 (12.87) H1 34 (1.34) 43.5 (1.71) 52 (2.05) 62 (2.44) 67 (2.64) 79.5 (3.13) H2 77 (3.03) 84 (3.31) 93 (3.66) 100 (3.94) 108 (4.25) 120.5 (4.74) D 68 (2.68) 87 (3.43) 104 (4.09) 124 (4.88) 134 (5.28) 159 (6.26) Weight (kg) 3.7 (8.2 lb) 3.8 (8.4 lb) 4.3 (9.5 lb) 4.4 (9.7 lb) 5.0 (11.0 lb) 5.5 (12.1 lb) 6.4 (14.1 lb) 7.1 (15.7 lb) 8.2 (18.1 lb) 9.2 (20.3 lb) Wafer type Size 25 mm and 100 mm (1 inch and 4 inches) (Unit : mm (inch)) Symbol Description Flow rate signal Grounding Pulse output or contact output (selectable) Terminal Name plate M4 grounding terminal Case Electrode L Refer to note1 Grounding ring (5.33) (3.37) (1.97) (1.85) (0.98) (2.76) ( 4.41) D (5) H (H1) H2 (5.35) 4 11